• Self-assembled monolayers patterned by microcontact printing (μCP) and SAM-based resist strategies emerged as a unifying approach for patterning metals and semiconductors, enabling direct metalization, selective etching, and submicron feature control across planar and nonplanar substrates. [4], [1], [6], [2], [8], [5], [3].

• Soft lithography provides elastomer stamps, phase masks, and replica molding enabling pattern generation, replication, and transfer at micro to nano scales, reducing cost and enabling rapid prototyping. [9], [14], [15], [18], [11], [4].

• A suite of imprint, self-assembly and block-copolymer based lithography methods achieved nanoscale patterning down to sub-10 nm, using NIL, NSL, BCP lithography, and sub-10 nm imprint. [15], [19], [16], [18].

• Pattern transfer and growth control via SAM-templated routes enable selective deposition, etching and morphology control, aligning chemical patterning with material processing for multi-scale patterning. [1], [2], [8], [5].